Electric diffusion bonding device and method and 2 other patents: Patent

■Electrical diffusion bonding device and method (Japan/USA)

Patent number: 4890633

■Electrical heating bonding device and method (Japan/USA)

Patent number: 5984109

■Insert molding device and method (Japan)

Patent number: 5928949

●Desired selling price: “Exclusive license” initial 100 million yen + royalties, “Exclusive sales rights” initial 50 million yen + royalties